Топ-10 конкурентов pactech.com

pactecinc.com

Resource Library Blog Case Studies Brochures & Guides Videos Tools Testimonials Asset Protection Dewatering Flexible Waste Packaging Nuclear Waste

dkhitek.com

디케이하이텍(주)은 산업 현장의 효율성을 극대화하는 고품질 장비 설계하고 생산합니다.

micrope.com

Custom Wafer Dicing Services MPE, Inc. takes pride in being a detail-oriented and innovative wafer dicing service provider. The wafer dicing services we provide are also known as wafer cutting, die singulation, mechanical dicing, or mechanical sawing. We are committed to providing superior customer service, while utilizing advanced technology and processes. This allows us to decrease the costs to our customers and increase the quality of their product. Each wafer will be diced with specially customized parameters to minimize yield loss. We utilize Loadpoint dicing saws, which have Windows based operating systems, allowing us to easily use techniques such as multi-pass cuts, ramp up table/ feed rates, and plunge cuts. We also keep in stock a variety of blade types, which allow us to process different materials and thicknesses while maintaining cut quality. We can accept orders ranging from a single wafer or substrate to hundreds of wafers per month. We have experience working with virtually every type of material in the industry including alumina, AlN, GaN (gallium nitride), fused silica, glass, quartz, germanium, SiC, lexan, Lithium niobate (LiNbO3), SOI, Silicon-Germanium (SiGe), and silicon wafers. We have high pressure wash stations that allow us to effectively clean wafers after the dicing process. We also utilize multiple tape vendors to meet our customers’ specifications, and our UV exposure capability allows us to cure tape prior to shipping. We also have processes in place to help with staining and undesirable metal plating caused by galvanic erosion or corrosion.

wafer-dicing.com

This blog post explores APD’s expertise in photoresist application, a crucial step in wafer processing for semiconductor manufacturing. It explains the importance of photoresist in protecting wafer surfaces during etching and other processes, highlighting APD's commitment to precision and quality in every step. The post also covers the types of materials handled and the advanced techniques used to ensure optimal results.

gpp-co.com

Yankton updates may 7, 2018 This past weekend was a busy one for the dryer installation at Great Plains Processing in Yankton, South Dakota. Sloppy conditions much like the Kentucky Derby posed a challenge but we managed to mud our dryer into the building last Friday. Over the weekend crews worked on putting together some […]

practicalcomponents.com

IPC Validation Services. Taking Certification to the Enterprise and Product Level.

ksmedix.com

熊本の企業を紹介する情報紙のワークインクマモトの最新号 （共栄コア様、トゥーワンプランニング様出版） に当社が

chipmos.com

南茂科技是在半導體封裝測試領域中具領先地位的公司，其中液晶顯示器驅動IC封裝測試產能排名位居全世界第二位。我們不僅為客戶提供記憶體半導體及混合訊號產品多元化的後段測試服務，近幾年來對於LCD驅動積體電路產品也是積極地擴大產能和增加技術服務項目。我們在記憶體半導體、混合訊號及LCD驅動積體電路等產品的封裝技術服務，提供包括導線架及有機基板等多樣化技術的選擇。這些產品主要應用於個人用電腦、通訊設備、辦公室自動化及消費性電子產品等等。

vmsemi.com

브이엠(주)는 반도체 식각장비를 개발, 판매하는 기업입니다.

nlight.net

In the race to improve the productivity of PBF-LB Additive Manufacturing, machine OEMs have generally taken the path of adding more lasers. nLIGHT takes the view that it's not necessarily just more lasers that are needed, but beam-shaping lasers. By using dynamic beam shaping technology, significant