Analyse ExPlus de la part de marché pour janvier 2026

In a previous article, we introduced inner layer processing and pretreatment. Today, we will focus on exploring the dry film aspect.Traditional Dry Film ProcessUse a photomask to transfer the design pattern onto the dry film via exposure.Perform the development process to remove unexposed areas, leaving the desired pattern.Proceed with etching or electroplating.Application Scenario: Suitable for mass production of PCBs with moderate specification requirements.Laser Dry Film (Laser Direct Imaging, LDI) ProcessNo photomask is required; the laser directly draws the design pattern onto the dry film.After laser imaging, perform development to remove unexposed areas.Continue with etching or electroplating.Application Scenario: Ideal for high-density PCBs and semiconductor package substrates (e.g., BGA, CSP) requiring precise patterns.Advantages and Future TrendsAdvantages of Laser Dry Film:Eliminates the labor and material costs associated with photomasks.Accurately meets the increasing demands for high-density and high-performance modern electronics.Better suited for rapid design iteration and customization needs.Future Trends:As LDI equipment costs decrease and the technology becomes more widespread, laser dry film technology will gradually become mainstream, particularly in the production of high-end electronic products and semiconductor substrates.